Product details

Protocols 6LoWPAN, Amazon Sidewalk, IEEE 802.15.4, MIOTY, Wi-SUN, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, OOK Frequency bands 1069-1329, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 14 RAM (kByte) 144 Flash memory (kByte) 704 CPU Arm® Cortex®-M4F Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Sensitivity (best) (dBm) -121 Number of GPIOs 30 RX current (lowest) (mA) 5.4 Data rate (max) (Mbps) 2 Rating Catalog Operating temperature range (°C) -40 to 105
Protocols 6LoWPAN, Amazon Sidewalk, IEEE 802.15.4, MIOTY, Wi-SUN, Wireless M-Bus Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, OOK Frequency bands 1069-1329, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 14 RAM (kByte) 144 Flash memory (kByte) 704 CPU Arm® Cortex®-M4F Peripherals 12-bit ADC 8-channel, 2 SPI, 2 UART, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Sensitivity (best) (dBm) -121 Number of GPIOs 30 RX current (lowest) (mA) 5.4 Data rate (max) (Mbps) 2 Rating Catalog Operating temperature range (°C) -40 to 105
VQFN (RGZ) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 2.63 mA active mode, CoreMark
    • 55 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 25.2 µA in 2 MHz mode
    • 701 µA in 24 MHz mode
  • Radio Consumption:
    • 5.4 mA RX at 868 MHz
    • 24.9 mA TX at +14 dBm at 868 MHz

Wireless protocol support

High performance radio

  • -121 dBm for 2.5-kbps long-range mode
  • -110 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +14 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 704KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 144KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 2.63 mA active mode, CoreMark
    • 55 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 144KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 25.2 µA in 2 MHz mode
    • 701 µA in 24 MHz mode
  • Radio Consumption:
    • 5.4 mA RX at 868 MHz
    • 24.9 mA TX at +14 dBm at 868 MHz

Wireless protocol support

High performance radio

  • -121 dBm for 2.5-kbps long-range mode
  • -110 dBm at 50 kbps, 802.15.4, 868 MHz
  • Output power up to +14 dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 303 131, EN 303 204
    • FCC CFR47 Part 15
    • ARIB STD-T108

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • -40 to +105°C

Package

  • 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC1312R7 device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty , Wi-SUN , proprietary systems, including the TI 15.4-Stack (Sub-1 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC1312R7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC1312R7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 287 to 351-MHz, 359 to 527-MHz, 861 to 1054-MHz, and 1076 to 1315-MHz frequency bands. PHY and frequency band switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC1312R7 has an efficient built-in PA that supports +14 dBm TX at 24.9 mA current consumption. In RX it has -121 dBm sensitivity and 88 dB blocking ±10 MHz in SimpleLink™ long-range mode with 2.5-kbps data rate.

The CC1312R7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC1312R7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1312R7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC1312R7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC1312R7 device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty , Wi-SUN , proprietary systems, including the TI 15.4-Stack (Sub-1 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC1312R7 is based on an Arm® Cortex® M4F main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC1312R7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in 287 to 351-MHz, 359 to 527-MHz, 861 to 1054-MHz, and 1076 to 1315-MHz frequency bands. PHY and frequency band switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC1312R7 has an efficient built-in PA that supports +14 dBm TX at 24.9 mA current consumption. In RX it has -121 dBm sensitivity and 88 dB blocking ±10 MHz in SimpleLink™ long-range mode with 2.5-kbps data rate.

The CC1312R7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

The CC1312R7 has Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime. Always-on SRAM parity minimizes risk for corruption due to potential radiation events. Consistent with many customers’ 10 to 15 years or longer life cycle requirements, TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC1312R7 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty®, Sub-1 GHz MCUs, and host MCUs. CC1312R7 is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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Technical documentation

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Type Title Date
* Data sheet CC1312R7 SimpleLink™ High-Performance Sub-1 GHz Wireless MCU datasheet (Rev. A) PDF | HTML 30 Nov 2021
* Errata CC1312R7 Silicon Errata (Rev. A) PDF | HTML 18 Jan 2022
* User guide CC13x2x7 and CC26x2x7 Technical Reference Manual PDF | HTML 24 Feb 2023
User guide SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 02 May 2024
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 09 Apr 2024
Product overview TI Wi-SUN® FAN Stack - Software Overview (Rev. A) PDF | HTML 01 Nov 2023
Application note TI 15.4-Stack Software PDF | HTML 17 Oct 2023
More literature Hardware Design Review Request Form for SimpleLink Sub-1GHz Devices (Rev. B) 20 Sep 2023
Cybersecurity advisory Bluetooth SIG Erratum - Incoming Notification/Indication Tests Upon Reconnection PDF | HTML 28 Aug 2023
Cybersecurity advisory Texas Instruments Wi-SUN® Stack: Absence of Frame Counter Validation PDF | HTML 09 May 2023
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mar 2022
Application note 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 07 Feb 2022
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20 Dec 2021
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 04 Jun 2021
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 12 Apr 2021

Design & development

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Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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