SWRS282
February 2024
CC2340R2
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagram – RGE Package (Top View)
6.2
Signal Descriptions – RGE Package
6.3
Connections for Unused Pins and Modules – RGE Package
6.4
RGE Peripheral Pin Mapping
6.5
RGE Peripheral Signal Descriptions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
DCDC
7.5
Global LDO (GLDO)
7.6
Power Supply and Modules
7.7
Battery Monitor
7.8
Temperature Sensor
7.9
Power Consumption - Power Modes
7.10
Power Consumption - Radio Modes
7.11
Nonvolatile (Flash) Memory Characteristics
7.12
Thermal Resistance Characteristics
7.13
RF Frequency Bands
7.14
Bluetooth Low Energy - Receive (RX)
7.15
Bluetooth Low Energy - Transmit (TX)
7.16
2.4 GHz RX/TX CW
7.17
Timing and Switching Characteristics
7.17.1
Reset Timing
7.17.2
Wakeup Timing
7.17.3
Clock Specifications
7.17.3.1
48 MHz Crystal Oscillator (HFXT)
7.17.3.2
48 MHz RC Oscillator (HFOSC)
7.17.3.3
32 kHz Crystal Oscillator (LFXT)
7.17.3.4
32 kHz RC Oscillator (LFOSC)
7.18
Peripheral Characteristics
7.18.1
UART
7.18.1.1
UART Characteristics
7.18.2
SPI
7.18.2.1
SPI Characteristics
7.18.2.2
SPI Controller Mode
7.18.2.3
SPI Timing Diagrams - Controller Mode
7.18.2.4
SPI Peripheral Mode
7.18.2.5
SPI Timing Diagrams - Peripheral Mode
7.18.3
I2C
7.18.3.1
I2C
7.18.3.2
I2C Timing Diagram
7.18.4
GPIO
7.18.4.1
GPIO DC Characteristics
7.18.5
ADC
7.18.5.1
Analog-to-Digital Converter (ADC) Characteristics
7.18.6
Comparators
7.18.6.1
Ultra-low power comparator
7.19
Typical Characteristics
7.19.1
MCU Current
7.19.2
RX Current
7.19.3
TX Current
7.19.4
RX Performance
7.19.5
TX Performance
7.19.6
ADC Performance
8
Detailed Description
8.1
Overview
8.2
System CPU
8.3
Radio (RF Core)
8.3.1
Bluetooth 5.3 Low Energy
8.4
Memory
8.5
Cryptography
8.6
Timers
8.7
Serial Peripherals and I/O
8.8
Battery and Temperature Monitor
8.9
µDMA
8.10
Debug
8.11
Power Management
8.12
Clock Systems
8.13
Network Processor
9
Application, Implementation, and Layout
9.1
Reference Designs
9.2
Junction Temperature Calculation
10
Device and Documentation Support
10.1
Device Nomenclature
10.2
Tools and Software
10.2.1
SimpleLink™ Microcontroller Platform
10.3
Documentation Support
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RKP|40
MPQF261B
RGE|24
MPQF124G
Thermal pad, mechanical data (Package|Pins)
RKP|40
QFND309E
RGE|24
QFND008AA
Orderable Information
swrs282_oa
Data Sheet
CC2340R2
SimpleLink™
Bluetooth
®
5.3 Low Energy Wireless MCU